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TBK Automatic Center Positioning Mold for Phone back cover glass removal LCD Screen repair and LOGO marking
Temperature stability: +/- 1℃
Flashing FullFlash binary files
one button to start
Demo video:http://v
SUGON 8620DX 1000W Hot Air Rework Station With 45 Degree Nozzles BGA Rework Station TBK Automatic Center Positioning MoldSUGON 8620DX Pro 1300W Hot Air Gun BGA Rework Station With with 6pcs nozzles(4mm 6mm 9mm 11mm Straight air nozzle and 7mm 9mm spiral nozzles) For Mobile Phone BGA SMD Chip welding desoldering. Sugon 8620DX Pro Microcomputer Temperature Control BGA Rework Station. Note: 1. The entire machine parts have been upgraded, and the air volume control has been increased by 80%. Current air volume speed adjustment 1 200. 2. Temperature range: 100 500(212 932).
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